Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449900 | Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow | Saravuth Sirinorakul | 2016-09-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449900 | Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow | Saravuth Sirinorakul | 2016-09-20 |