Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9405089 | High-temperature isotropic plasma etching process to prevent electrical shorts | Neng Jiang, Joel Soman, Mary Alyssa Drummond Roby, Nayeemuddin Mohammed, YungShan Chang | 2016-08-02 |
| 9304283 | Bond-pad integration scheme for improved moisture barrier and electrical contact | Joel Soman, Neng Jiang, Scott R. Summerfelt, Nayeemuddin Mohammed, Mary Alyssa Drummond Roby | 2016-04-05 |
| 9245855 | Methods and apparatus to reduce semiconductor wafer warpage in the presence of deep cavities | Simon Chang, Jamie T. Stapleton, Maciej Blasiak | 2016-01-26 |