Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524881 | Method for fabricating specific termination angles in titanium tungsten layers | Neng Jiang, Nicholas Stephen Dellas, Brian E. Goodlin | 2016-12-20 |
| 9245855 | Methods and apparatus to reduce semiconductor wafer warpage in the presence of deep cavities | Simon Chang, Thomas Warren Lassiter, Jamie T. Stapleton | 2016-01-26 |