Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515009 | Packaged semiconductor device having leadframe features preventing delamination | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2016-12-06 |
| 9496206 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2016-11-15 |
| 9324640 | Triple stack semiconductor package | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2016-04-26 |