Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515009 | Packaged semiconductor device having leadframe features preventing delamination | Sueann Lim Wei Fen, Lee Han Meng@ Eugene Lee | 2016-12-06 |
| 9496206 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2016-11-15 |
| 9324640 | Triple stack semiconductor package | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2016-04-26 |
| 9275983 | Integrated circuit package | Lee Han Meng@ Eugene Lee, Yien Sien Khoo | 2016-03-01 |