Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312242 | Dense-pitch small-pad copper wire bonded double IC chip stack packaging piece and preparation method therefor | Wei Mu, Xizhou Li | 2016-04-12 |
| 9275941 | Quad flat no lead package and production method thereof | Wenhui Zhu, Wei Mu, Zhaoming Xu | 2016-03-01 |