Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397068 | Package in package (PiP) electronic device and manufacturing method thereof | Fei Qin, Guofeng Xia, Tong An, Wei Wu, Chengyan Liu | 2016-07-19 |
| 9275941 | Quad flat no lead package and production method thereof | Wei Mu, Zhaoming Xu, Xiaowei Guo | 2016-03-01 |