Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460957 | Method and structure for nitrogen-doped shallow-trench isolation dielectric | Shing-Long Lee, Chung-Han Lin, Kuang-Jung Peng, Yun-Min Chang, Shou-Wen Kuo | 2016-10-04 |
| 9349610 | Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof | Tsung C. Whang | 2016-05-24 |