Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349610 | Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof | Yi-Chieh Wang | 2016-05-24 |
TW
Tsung C. Whang
Global Unichip: 1 patents #16 of 54Top 30%
Overall (2016): #195,613 of 481,213Top 45%
1
Patents 2016