Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379061 | High density dielectric etch-stop layer | Han-Ti Hsiaw, Keng-Chu Lin | 2016-06-28 |
| 9373581 | Interconnect structure and method for forming the same | Po-Cheng Shih, Chih-Hung Sun, Chia-Cheng Chou, Kuang-Yuan Hsu | 2016-06-21 |
| 9349689 | Semiconductor devices including conductive features with capping layers and methods of forming the same | Hui-Chun Yang, Mei-Ling Chen, Keng-Chu Lin | 2016-05-24 |
| 9341945 | Photoresist and method of formation and use | Keng-Chu Lin, Cheng-Han Wu, Ya Hui Chang | 2016-05-17 |
| 9269614 | Method of forming semiconductor device using remote plasma treatment | Po-Cheng Shih, Hui-Chun Yang, Chih-Hung Sun | 2016-02-23 |
| 9257331 | Method of making interconnect structure | Po-Cheng Shih, Yu-Yun Peng, Chia-Cheng Chou | 2016-02-09 |
| 9236294 | Method for forming semiconductor device structure | Chia-Cheng Chou, Chung-Chi Ko, Po-Cheng Shih, Chih-Hung Sun, Kuang-Yuan Hsu +1 more | 2016-01-12 |