HW

Hsin-Wei Wu

TSMC: 2 patents #914 of 2,623Top 35%
Overall (2016): #137,161 of 481,213Top 30%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9425290 Formation of high quality fin in 3D structure by way of two-step implantation Chun-Feng Nieh, Tsun-Jen Chan, Yu-Chang Lin 2016-08-23
9343312 High temperature intermittent ion implantation Tsun-Jen Chan, Chun-Feng Nieh, Hsing-Jui Lee, Yu-Chi Fu 2016-05-17