Issued Patents 2016
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530813 | Seal ring structure with rounded corners for semiconductor devices | Volume Chien, Yun-Wei Cheng, I-l Cheng, Shiu-Ko JangJian, Hsin-Chi Chen | 2016-12-27 |
| 9520424 | Black level correction (BLC) structure | Shiu-Ko JangJian, Volume Chien | 2016-12-13 |
| 9502538 | Structure and formation method of fin-like field effect transistor | Shiu-Ko JangJian, Tzu kai Lin | 2016-11-22 |
| 9490288 | Image sensor with trenched filler grid within a dielectric grid including a reflective portion, a buffer and a high-K dielectric | Feng-Chien Hsieh, Shih-Ciang Huang, Volume Chien, Zhe-Ju Liu, Wang Chun-Ying +1 more | 2016-11-08 |
| 9490365 | Structure and formation method of fin-like field effect transistor | Shiu-Ko JangJian, Tzu kai Lin | 2016-11-08 |
| 9490346 | Structure and formation method of fin-like field effect transistor | Shiu-Ko JangJian, Tzu kai Lin | 2016-11-08 |
| 9478660 | Protection layer on fin of fin field effect transistor (FinFET) device structure | Shiu-Ko JangJian, Chih-Nan Wu, Chun Che Lin, Ting-Chun Wang | 2016-10-25 |
| 9478578 | Stress release layout and associated methods and devices | Chun-Hao Chou, Tsung-Han Tsai, Kuo-Cheng Lee, Volume Chien, Yen-Hsung Ho +1 more | 2016-10-25 |
| 9473719 | Protection layer in CMOS image sensor array region | Volume Chien, Yi-Sheng Liu, Chia-Yu Wei, Yun-Wei Cheng | 2016-10-18 |
| 9450014 | Backside illumination image sensor chips and methods for forming the same | I-I Cheng, Chih-Mu Huang, Pin Chia Su, Volume Chien, Chih-Kang Chao | 2016-09-20 |
| 9443996 | Dielectric structure for color filter array | Yin-Chieh Huang, Kuo-Cheng Lee | 2016-09-13 |
| 9431446 | Mechanisms for forming image sensor device | Volume Chien, Fu-Cheng Chang, Yi-Hsing Chu, Shiu-Ko JangJian | 2016-08-30 |
| 9419048 | Method of manufracturing structure of dielectric grid for a semiconductor device | Chun-Hao Chou, Yin-Chieh Huang, Kuo-Cheng Lee, Hsin-Chi Chen | 2016-08-16 |
| 9406499 | Semiconductor wafer structure | Chen-Chun Chen, Chiu-Jung Chen, Fu-Tsun Tsai, Shiu-Ko JangJian, Hsin-Chi Chen | 2016-08-02 |
| 9397129 | Dielectric film for image sensor | Volume Chien, Che-Min Lin, Shiu-Ko JangJian, Chih-Mu Huang | 2016-07-19 |
| 9373594 | Under bump metallization | Chih-Fei Lee, Fu-Cheng Chang, Hsin-Chi Chen, Yuan-Ko Hwang | 2016-06-21 |
| 9368540 | CIS image sensors with epitaxy layers and methods for forming the same | Shiu-Ko JangJian, Min Hao Hong, Kei-Wei Chen | 2016-06-14 |
| 9349902 | System and method for reducing irregularities on the surface of a backside illuminated photodiode | Shiu-Ko JangJian, Kei-Wei Chen, Min Hao Hong | 2016-05-24 |
| 9337192 | Metal gate stack having TaAlCN layer | Shiu-Ko JangJian, Ting-Chun Wang, Chi-Wen Liu | 2016-05-10 |
| 9337303 | Metal gate stack having TiAICN as work function layer and/or blocking/wetting layer | Shiu-Ko JangJian, Chi-Wen Liu, Ting-Chun Wang | 2016-05-10 |
| 9324752 | Image sensor device with light blocking structure | Volume Chien, Kun-Huei Lin, Chia-Yu Wei, Allen Tseng, Chuan-Pu Liu | 2016-04-26 |
| 9318368 | Photomask and method for forming dual STI structure by using the same | Fu-Cheng Chang, Chai-Der Yen, Fu-Tsun Tsai, Chih-Mu Huang | 2016-04-19 |
| 9293490 | Deep trench isolation with air-gap in backside illumination image sensor chips | Volume Chien, Yu-Heng Cheng, Huan-En Lin, Fu-Tsun Tsai | 2016-03-22 |
| 9247116 | Image sensor device with light guiding structure | Volume Chien, Su-Hua Chang, Zen-Fong Huang, Chia-Yu Wei, Hsin-Chi Chen | 2016-01-26 |
| 9240503 | Methods of manufacturing and using a photodiode with concave reflector | Che-Min Lin, Volume Chien, Chih-Kang Chao, Pin Chia Su, Chih-Mu Huang | 2016-01-19 |