Issued Patents 2016
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9275950 | Bead for 2.5D/3D chip packaging application | Feng-Wei Kuo, Huan-Neng Chen, Der-Chyang Yeh, Chuei-Tang Wang | 2016-03-01 |
| 9255963 | Built-in self-test circuit for voltage controlled oscillator | Hsieh-Hung Hsieh, Ming-Hsien Tsai, Tzu-Jin Yeh, Fu-Lung Hsueh | 2016-02-09 |