Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401347 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee | 2016-07-26 |
| 9379064 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | JiHoon Oh, JinGwan Kim | 2016-06-28 |