Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401347 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | SinJae Lee, JinGwan Kim, JiHoon Oh, Jaehyun LIM | 2016-07-26 |