Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362217 | Package on package structure and fabrication method thereof | Pang-Chun Lin, Wei Wang, Chun-Yuan Li, Ying-Chou Tsai | 2016-06-07 |
| 9265154 | Packaging substrate and fabrication method thereof | Chi-Ching Ho, Ying-Chou Tsai | 2016-02-16 |