Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455159 | Fabrication method of packaging substrate | Wei Wang, Chin-Chih Hsiao, Kuan-I Cheng, Cheng-Wen Chiu | 2016-09-27 |
| 9362217 | Package on package structure and fabrication method thereof | Wei Wang, Chun-Yuan Li, Shao-Tzu Tang, Ying-Chou Tsai | 2016-06-07 |
| 9318354 | Semiconductor package and fabrication method thereof | Xie-Ren Cheng | 2016-04-19 |