Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514985 | Electroless metal through silicon via | Henrik Knutsson | 2016-12-06 |
| 9511999 | Thin film capping | Niklas Svedin | 2016-12-06 |
| 9484293 | Semiconductor devices with close-packed via structures having in-plane routing and method of making same | Daniel Perttu | 2016-11-01 |
| 9448401 | Via structure and method thereof | Edvard Kalvesten, Peter Agren, Niklas Svedin | 2016-09-20 |
| 9362139 | Method of making a semiconductor device having a functional capping | Edvard Kalvesten, Tomas Bauer | 2016-06-07 |
| 9355895 | Method of providing a via hole and routing structure | Daniel Perttu | 2016-05-31 |
| 9312217 | Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections | Edvard Kalvesten, Tomas Bauer | 2016-04-12 |
| 9240373 | Semiconductor devices with close-packed via structures having in-plane routing and method of making same | Daniel Perttu | 2016-01-19 |