Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485864 | Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method | Kei Imafuji, Katsumi Yamazaki, Noritaka Katagiri | 2016-11-01 |
| 9380712 | Wiring substrate and semiconductor device | — | 2016-06-28 |