Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485864 | Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method | Kei Imafuji, Katsumi Yamazaki, Teruaki Chino | 2016-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485864 | Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method | Kei Imafuji, Katsumi Yamazaki, Teruaki Chino | 2016-11-01 |