Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496238 | Sloped bonding structure for semiconductor package | Yi-Hsiu Tseng, Kuan-Neng Chen, Shu-Chiao Kuo | 2016-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496238 | Sloped bonding structure for semiconductor package | Yi-Hsiu Tseng, Kuan-Neng Chen, Shu-Chiao Kuo | 2016-11-15 |