Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496238 | Sloped bonding structure for semiconductor package | Min Shu, Yi-Hsiu Tseng, Shu-Chiao Kuo | 2016-11-15 |
| 9373564 | Semiconductor device, manufacturing method and stacking structure thereof | Wen-Wei Shen, Cheng-Ta Ko | 2016-06-21 |