Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9390992 | Semiconductor packages including a metal layer between first and second semiconductor chips | Heungkyu Kwon | 2016-07-12 |
SA
Sangho An
Overall (2016): #241,548 of 481,213Top 55%
1
Patents 2016