HK

Heungkyu Kwon

Samsung: 1 patents #6,237 of 13,934Top 45%
Overall (2016): #384,122 of 481,213Top 80%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9390992 Semiconductor packages including a metal layer between first and second semiconductor chips Sangho An 2016-07-12