Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520377 | Semiconductor device package including bonding layer having Ag3Sn | Jeong-Won Yoon, Seong-woon Booh, Chang Mo JEONG | 2016-12-13 |
| 9431374 | Semiconductor package | Seok Hyun LEE | 2016-08-30 |