Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520377 | Semiconductor device package including bonding layer having Ag3Sn | Baik Woo Lee, Seong-woon Booh, Chang Mo JEONG | 2016-12-13 |
JY
Jeong-Won Yoon
Overall (2016): #357,115 of 481,213Top 75%
1
Patents 2016