Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406747 | Component in the form of a wafer level package and method for manufacturing same | Heribert Weber, Hartmut Kueppers, Jens Frey, Jochen Reinmuth | 2016-08-02 |
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Neil Davies
Overall (2016): #279,188 of 481,213Top 60%
1
Patents 2016