Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406747 | Component in the form of a wafer level package and method for manufacturing same | Heribert Weber, Jens Frey, Neil Davies, Jochen Reinmuth | 2016-08-02 |
HK
Hartmut Kueppers
Overall (2016): #387,195 of 481,213Top 85%
1
Patents 2016