Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520332 | Wafer level package solder barrier used as vacuum getter | Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2016-12-13 |
| 9427776 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2016-08-30 |
| 9227839 | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy, Buu Q. Diep | 2016-01-05 |