Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520332 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2016-12-13 |
| 9427776 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2016-08-30 |
| 9334154 | Hermetically sealed package having stress reducing layer | Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2016-05-10 |
| 9227839 | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | Roland W. Gooch, Stephen H. Black, Thomas A. Kocian, Buu Q. Diep | 2016-01-05 |