Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343399 | Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim, Daeik Daniel Kim +2 more | 2016-05-17 |
| 9343403 | Stress mitigation structure for wafer warpage reduction | Je-Hsiung Lan, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun +3 more | 2016-05-17 |