Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9494409 | Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layer | Berthold Michelt | 2016-11-15 |
| 9297645 | Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer | — | 2016-03-29 |