Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412912 | Method for transferring light-emitting elements onto a package substrate | Ching-Liang Lin, Yu-Hung Lai, Pei-Hsin Chen | 2016-08-09 |
| 9312464 | Flip chip package structure and wafer level package structure | Shao-Hua Huang, Chih-Ling Wu, Yu-Yun Lo, Yu-Hung Lai | 2016-04-12 |