Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484330 | Light-emitting device | — | 2016-11-01 |
| RE46004 | Light-emitting chip device with high thermal conductivity | Ray-Hua Horng, Dong-Sing Wuu, Chuang-Yu Hsieh, Chao-Kun Lin | 2016-05-17 |
| 9312464 | Flip chip package structure and wafer level package structure | Chih-Ling Wu, Yu-Yun Lo, Tzu-Yang Lin, Yu-Hung Lai | 2016-04-12 |