Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9306254 | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration | Ian Hovey, J. Robert Reid, David W. Sherrer, Will Stacy | 2016-04-05 |
| 9306255 | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Will Stacy, J. Marcus Oliver +1 more | 2016-04-05 |