Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515364 | Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume | William D. HOUCK | 2016-12-06 |
| 9505613 | Devices and methods for solder flow control in three-dimensional microstructures | James Reid | 2016-11-29 |
| 9490517 | High frequency power combiner/divider | Donald X. Wu, Jean-Marc Rollin | 2016-11-08 |
| 9410799 | Device package and methods for the fabrication and testing thereof | — | 2016-08-09 |
| 9413052 | Three-dimensional microstructures | Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner | 2016-08-09 |
| 9337152 | Formulation for packaging an electronic device and assemblies made therefrom | James D. MacDonald, Jr. | 2016-05-10 |
| 9312589 | Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section | John J. Fisher | 2016-04-12 |
| 9306255 | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other | Jean-Marc Rollin, J. Robert Reid, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2016-04-05 |
| 9306254 | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration | Ian Hovey, J. Robert Reid, Will Stacy, Ken Vanhille | 2016-04-05 |