Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478454 | Dicing tape-integrated film for semiconductor back surface | Goji Shiga, Fumiteru Asai, Toshimasa SUGIMURA | 2016-10-25 |
| 9472439 | Reinforcing sheet and method for producing secondary mounted semiconductor device | Kosuke Morita, Hiroyuki Senzai | 2016-10-18 |
| 9368421 | Under-fill material and method for producing semiconductor device | Kosuke Morita, Hiroyuki Senzai | 2016-06-14 |
| 9362156 | Dicing tape-integrated film for semiconductor back surface | Takeshi Matsumura, Goji Shiga | 2016-06-07 |
| 9324616 | Method of manufacturing flip-chip type semiconductor device | Goji Shiga, Fumiteru Asai | 2016-04-26 |
| 9293387 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Yusuke Komoto, Goji Shiga, Fumiteru Asai | 2016-03-22 |
| 9279064 | Manufacturing semiconductor device with film for forming protective layer | Takashi Oda, Takeshi Matsumura | 2016-03-08 |