Naohide Takamoto — 7 Patents at Nitto Denko

Issued Patents 2016

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date
9478454	Dicing tape-integrated film for semiconductor back surface	Goji Shiga, Fumiteru Asai, Toshimasa SUGIMURA	2016-10-25
9472439	Reinforcing sheet and method for producing secondary mounted semiconductor device	Kosuke Morita, Hiroyuki Senzai	2016-10-18
9368421	Under-fill material and method for producing semiconductor device	Kosuke Morita, Hiroyuki Senzai	2016-06-14
9362156	Dicing tape-integrated film for semiconductor back surface	Takeshi Matsumura, Goji Shiga	2016-06-07
9324616	Method of manufacturing flip-chip type semiconductor device	Goji Shiga, Fumiteru Asai	2016-04-26
9293387	Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device	Yusuke Komoto, Goji Shiga, Fumiteru Asai	2016-03-22
9279064	Manufacturing semiconductor device with film for forming protective layer	Takashi Oda, Takeshi Matsumura	2016-03-08