Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478454 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Fumiteru Asai, Toshimasa SUGIMURA | 2016-10-25 |
| 9362156 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Takeshi Matsumura | 2016-06-07 |
| 9324616 | Method of manufacturing flip-chip type semiconductor device | Fumiteru Asai, Naohide Takamoto | 2016-04-26 |
| 9293387 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Yusuke Komoto, Naohide Takamoto, Fumiteru Asai | 2016-03-22 |