Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9414497 | Semiconductor package including an embedded circuit component within a support structure of the package | Jovica Savic, Zhiping Yang, Jie Xue | 2016-08-09 |
| 9337120 | Multi-chip module with multiple interposers | Subbarao Arumilli, Lin Shen | 2016-05-10 |