Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466571 | Systems and methods for high-speed, low-profile memory packages and pinout designs | Anthony Fai, Evan R. Boyle, Zhonghua Wu | 2016-10-11 |
| 9414497 | Semiconductor package including an embedded circuit component within a support structure of the package | Jovica Savic, Jie Xue, Li Li | 2016-08-09 |