Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490404 | Flip-chip light emitting diode package module and manufacturing method thereof | Meng-Sung Chou | 2016-11-08 |
| 9412724 | Chip-scale packaged LED device | KUO-MING CHIU, Shih-Chiang Yen, Meng-Sung Chou, Chen-Hsiu Lin | 2016-08-09 |