Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490404 | Flip-chip light emitting diode package module and manufacturing method thereof | Ming-Kun Weng | 2016-11-08 |
| 9441817 | Light-emitting structure | KUO-MING CHIU, Chen-Hsiu Lin | 2016-09-13 |
| 9412724 | Chip-scale packaged LED device | Ming-Kun Weng, KUO-MING CHIU, Shih-Chiang Yen, Chen-Hsiu Lin | 2016-08-09 |