Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466543 | Semiconductor package substrate, package system using the same and method for manufacturing thereof | Dong Sun Kim, Seung Yul Shin | 2016-10-11 |
| 9363883 | Printed circuit board and method for manufacturing same | Seong Bo Shim, Seung Yul Shin | 2016-06-07 |
| 9252112 | Semiconductor package | Dong Sun Kim, Ji Haeng Lee | 2016-02-02 |