Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466543 | Semiconductor package substrate, package system using the same and method for manufacturing thereof | Sung Wuk Ryu, Dong Sun Kim | 2016-10-11 |
| 9363883 | Printed circuit board and method for manufacturing same | Sung Wuk Ryu, Seong Bo Shim | 2016-06-07 |