Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462689 | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition | Geon Young Kil, Myeong Jeong Kim, Jae Man Park, Jong Heum Yoon, Jeung Ook Park +3 more | 2016-10-04 |
| 9282637 | Epoxy resin compound and radiant heat circuit board using the same | Hyuk Lee, In Hee Cho, Jae Man Park, Myeong Jeong Kim, Jong Heum Yoon +5 more | 2016-03-08 |