Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462689 | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition | Myeong Jeong Kim, Jae Man Park, Jong Heum Yoon, Jeung Ook Park, Sung Jin YUN +3 more | 2016-10-04 |