Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9505914 | Inorganic filler, resin composition comprising the same and heat radiation substrate using the same | Hyun Gu Im, Jae Man Park | 2016-11-29 |
| 9462689 | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition | Geon Young Kil, Myeong Jeong Kim, Jae Man Park, Jong Heum Yoon, Jeung Ook Park +3 more | 2016-10-04 |