Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9271087 | Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof | Tsung-Min Hsieh, Chien-Hsing Lee, Chih-Hsien Chung, Jhyy-Cheng Liou | 2016-02-23 |