Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478517 | Electronic device package structure and method of fabricating the same | Jong Sik Paek, Doo Hyun Park, Yoon Joo Kim, Seong Min Seo | 2016-10-25 |
| 9362210 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Suk Gu Ko, Sung Sik Jang, Young Nam Choi +1 more | 2016-06-07 |