Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412736 | Embedding semiconductor devices in silicon-on-insulator wafers connected using through silicon vias | Vibhor Jain, Thomas Kessler, Yves T. Ngu, Robert M. Rassel, Sebastian T. Ventrone | 2016-08-09 |
| 9408304 | Through printed circuit board (PCB) vias | Dana H. Brown, Hanyi Ding, John Ferrario | 2016-08-02 |